Increasing demand for functionality and capacity for memory, mixed signal and logic ICs, ATX die stacking process expertise offers a consistent product, high level of yield and reliability performance.
An established wafer thinning process down to 25um and with the use of thin DAF and advanced material such as Film over Wire (FOW), Die attach with capability to handle thin die pick and place, wirebonding with low loop down to 35um creates a robust process which is a main recipe for volume production.
By future roadmap, ATX is highly committed to developing an advanced packaging solution to be a able to address Memory, Mixed signal, and logic ever growing demand for capacity and functionality.
ATX Advantages
- • Stack Die capability
- • 30um wafer thinning capability for thin die requirements
- • DAF/FOW Capability
- • Extensive and Robust die stacking design rule
- • Conforms per JEDEC reliability requirement
Application
