With the onset of Bluetooth Audio Technology, wireless earbuds have experienced explosive business growth and currently represents one of the fastest-growing consumer product in audio segments.
One unique aspect of establishing TWS components is the necessity of software programming skills, which poses a challenge. This is the most complex part of audio module development, and our research and development department is currently fully committed to addressing these key requirements.
3D SiP stacking will be the main process tool to maximize benefits for TWS assembly
- • Downsizing
- • High density function integration
- • Better space utilization
Application
