In current and future complex field of communication, ultra high speed, ultra high-frequency, extreme low-latency and multiple channel characteristics have bought the highest technical challenges to a semiconductor packaging capability. By providing a full range of advanced packaging and testing solutions, development collaboration in design and simulations, and by offering of full automated assembly are the key recipe to address the complexity of the modern communication assembly requirements.
Packaging Solutions
- • FCQFN, FCBGA, FCCSP
- • SiP
- • DSM, DSA
- • SOIC, SSOP
- • QFP
Application
