Technology

With the increasing demand for a higher level of integration combined with a more cost-effective approach in the semiconductor industry, ATX has been engaged with System in Package (SiP) as one of its main stream of assembly solutions. ATX can offer a vast variety of system integration that may include passive components, SAW/BAW filters, Flip chip, dice with wire bond, die coating, and EMI shielding.

ATX establish wafer bumping capability in its Mega factory in the City of Kunshan. This have facility for both Cu Pillar, Au bump, and ranges of wafer bumping methodology in order to support the full turn-key requirement of our customers. This wafer bumping capability can significantly provide several advantages into performance, form factor and cost into semiconductor packages. By implementing a direct connection by means of solder balls or bumps into wafers, it creates an optimum signal path between all electrical connections within the entire functional systems.

For bumped wafers, ATX is currently offering a Die Preparation Services (DPs) and a full WLCSP capability which involve wafer lamination process and probing test process. in addition to beingcommited for offering a ful turn-key services, ATX has released CAPEX to establish its own waferbumping capability at ATX Kunshan. This will enable ATX to have a full freedom to control its packageoffering to the customers that will reguire a highly and advanced integration in terms of density and functionality.

ATX is highly committed towards providing its customers an advanced assembly technology, Through Silicon Via (TSV) interconnects has been added into its assembly capability roadmap. This will enable a wide range of 2.5D and 3D packaging solutions and architectures. These 2.5D and 3D packaging capability to address future customers'requirements for applications that demands very high level of performance and functionality at the lowest energy application.

ATX with its strong commitment into process assembly integration, Package on Package (PoP) is one of the major focus of development with the use of bare Cu post or substrate interposer solutions.

ATXWH is a globally significant manufacturer of discrete device assembly and test services, specializing in the packaging and testing of power semiconductor devices. Its main products include over 50 packaging forms such as the full TO Power series, SOT/SC series, and DFN series, covering MOSFET, IGBT, SiC, GaN, and other products, with an annual production capacity of 5.7 billion units. These products are widely used in electric vehicles, industrial control, automotive electronics, renewable energy (such as photovoltaics), household appliances, consumer electronics, and other fields. In particular, it holds a high market share in the field of international brand electric vehicle controllers.

Current and future smart applications, will be increasingly rely on developments in optical sensors in order to enable faster sensing capability thru complex applications. As optical sensors convert various wavelengths into electrical signals, ATX is continually developing a state of the art packaging solutions to be able to overcome the various sensitivity of sensor response into various environmental noise that's degrades its ability to carry out its optimal functions.

ATX is offering a wide variety of BGA packaging format to address the ever growing customer requirements for a lower thermal resistance, lower inductance and taking advantages of Higher number of interconnects into a smaller footprint.

ATX has been deeply involved in the field of leadframe packaging for many years, renowned for its advanced technology and extensive product line. Its main product categories encompass various forms of packaged semiconductor components, such as QFN, QFP, SOP, TSSOP, among others, which are widely used in various electronic products. The packaging process at ATX is complex and precise, with every step from die bonding to wire bonding and encapsulation molding being strictly controlled to ensure that the packaged semiconductor components exhibit exceptional stability and reliability. The company emphasizes the selection of packaging materials and process innovation, continuously introducing advanced technologies and equipment to meet the demands of different customers for high-quality semiconductor components.

Flip-chip packaging is one of the most advantageous solutions, featuring a shorter production cycle, high signal density, thinness and small size, excellent electrical performance, a direct heat dissipation path.The packaging forms based on lead frames include FCQFN, FCSOT, FCTSOT, and others. In-line FC can ensure advantages in quality, efficiency, and process costs. RF applications with flip-chips as the main components, including FCSiP, FCCSP, FCBGA, MEMS, Power Modules, etc., maximize signal integrity by reducing the signal path, making them crucial for high-speed communication and switching equipment. For power module applications, it can directly deliver power to the die, unlike traditional wire-bonded circuits that require additional paths. In general, flip-chip packaging reduces package size due to the elimination of wirebonding processes and the use of direct connections. The reduction in chip size is also one of the advantages of flip-chip packaging.

ATX power discretes packaging portfolio, includes the advance power module assembly and Cu Clip attach with PbSnAg and lead-free options. From the simplest packaging capability for Through Hole (TO247, TO228, TO3P family), DPAK, LFPAK, SOT, and SOP up to the most complex DFN, small QFN, multi chip QFN, and TOLL packages, ATX has the proven high volume manufactured experience for several years. ATX is one of the industries’ most modern and state of the art Sn plating facilities that can cater to a large volume capacity requirement from the customers. It is a dedicated site of ATX in handling non-lead free material as a main Bill of Materials in power discrete packages.

Market demand for integration of multiple MEMS devices: accelerometer, magnetometer, gyroscope & controller in the same package: • Heterogeneous integration – CMOS Logic, memory, MEMs, passives, battery – is becoming key communicant & autonomous MEMs SiP. • New requirements for safety devices are appearing – Die redundancy with in same package. • There is an evident necessity for high functionality package solutions (Multi die-stack or side-by-side, thinner, heterogeneous integration, etc…) at reasonable costs and smaller sizes. • Wafer Level Packaging and more specifically WLP with 3D interconnection (TSV,TGV) are driving the integration for size reduction, better electrical connection and cost.