Package on Package (PoP)

Semiconductor industry involving automotive application has increased significantly through the advanced automotive intelligence and battery technology. Automotive semiconductors involve variations of packages that have access to engine system, lightning, and infotainment components. ATX has vast amount of packaging portfolio and manufacturing solutions for the development of Automotive ecosystem. Packaging Technology: • QFN with wettable flank features • Flip chip • MEMs and Sensor • Power module • SOIC and TSOP Legacy packages • Power Discrete

ATX has a high varieties of assembly toolbox for RF and other 5G radio requirements. This is to make sure that ATX is at the forefront of technological advancement to address the challenges that are associated with 5G. ATX has made a significant investment to establish its own RF Laboratory and to offer the shortest turn-around time in Developing and fine tuning of RF products. With Suzhou Campus as the center of its R&D Department and Engineering Center, ATX ensures that customers can have the benefits of 5G services at its highest excellence, through the advanced RF hardware resources, engineering skills, and development facilities available. Customer can co-work to develop models for electrical, thermal, and mechanical simulations. As an extended service, ATX can offer its customers with its signal integrity simulation, test, and RF characterization capability. 1. Ag sintering with capability up to >200W/mK for enhance thermal conductivity. 2. RF Shielding Capability 3. Double Sided Module (DSM) with Solder Ball and Cu Post Solutions. 4.Study Bonding for SAW/BAW Filters. 5. Wirekgnd tuning capability during development & Mass Production periodic monitor.. 6. RF Lab support during product development.

In current and future complex field of communication, ultra high speed, ultra high-frequency, extreme low-latency and multiple channel characteristics have bought the highest technical challenges to a semiconductor packaging capability. By providing a full range of advanced packaging and testing solutions, development collaboration in design and simulations, and by offering of full automated assembly are the key recipe to address the complexity of the modern communication assembly requirements.

As World-Wide-Web application is becoming the main stream for connecting people, Internet of Things (IOT) is the one responsible for the connectivity of objects. These includes:

Increasing demand for functionality and capacity for memory, mixed signal and logic ICs, ATX die stacking process expertise offers a consistent product, high level of yield and reliability performance. An established wafer thinning process down to 25um and with the use of thin DAF and advanced material such as Film over Wire (FOW), Die attach with capability to handle thin die pick and place, wirebonding with low loop down to 35um creates a robust process which is a main recipe for volume production. By future roadmap, ATX is highly committed to developing an advanced packaging solution to be a able to address Memory, Mixed signal, and logic ever growing demand for capacity and functionality.

With the onset of Bluetooth Audio Technology, wireless earbuds have experienced explosive business growth and currently represents one of the fastest-growing consumer product in audio segments. 建立TWS组件的一个独特之处和困难需要软件编程能力。 这是 音频模块开发中最复杂的部分和 我们的研发部门目前正在全力解决这些主要问题要求。 3D SiP stacking will be the main process tool to maximize benefits for TWS assembly: • Downsizing • High density function integration • Better space utilization

Wearable products refer to smart devices that can be worn directly on the user's body, utilizing integrated technologies such as sensors, processors, and wireless communications to achieve various functions including health monitoring, information reminders, entertainment interactions, and more. They typically come in the form of watches, bracelets, glasses, clothing, and other forms, providing users with a more convenient and intelligent life experience.