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System in Package

System in Package

With the increasing demand for a higher level of integration combined with a more cost-effective approach in the semiconductor industry, ATX has been engaged with System in Package (SiP) as one of its main stream of assembly solutions.

ATX can offer a vast variety of system integration that may include passive components, SAW/BAW filters, Flip chip, dice with wire bond, die coating, and EMI shielding.

  • DSM
  • DSA
  • AiP/AoP

  • To be able to address the fast growing needs and high level of integration for 5G Front End Modules (FEM), ATX has enabled Double Sided Molded Module (DSM) as an addition to its packaging capability.

    ATX offers 2 generations of DSM packaging solution in able to achieve final package with a thinner and fine pitch I/O.

    •Generation 1 uses the ball first solution with strip grinding + laser ablation process to expose all solder ball at the bottom after mass reflow.

    •Generation 2 addresses a more advance requirement for thinner and fine pitch package configuration. Gen 2 uses the Cu post solution to overcome the process limitation of Gen 1.

  • To incorporate higher IC functionality for standard BGA, ATX uses the state of the art packaging solution to combine flip chip interconnect at the bottom side (I/O side) of the package.

    Double Sided Assembly (DSA), caters flip chip on laminate at the IO side. This enable an additional functionality without an increase in packaging footprint.

    Pushing DSA further into its limits, an option to use with substrate interposer allows another layer of functionality, providing higher density of package integration at its best.

  • Antenna in Package(AiP)/Antenna on Package(AoP), is a packaging capability that integrates the antenna functionality in an RF Transceiver chip. This unique characteristic of AiP/AoP can be implemented in various integration of Front-End Modules (FEM). Primary advantage of Antenna integration into SiP include:

    •Signal path reduction between the RF chip and physical Antenna.

    •Package footprint reduction/Small Form Factor

    •Package and Functionality optimization at the system level.

    As ATX primary goal to be one of the leader in RF technology, roadmap implementation of Antenna Integration into SiP is one of the current focus development.

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