Power Packaging
ATXWH is a globally significant manufacturer of discrete device assembly and test services, specializing in the packaging and testing of power semiconductor devices. Its main products include over 50 packaging forms such as the full TO Power series, SOT/SC series, and DFN series, covering MOSFET, IGBT, SiC, GaN, and other products, with an annual production capacity of 5.7 billion units. These products are widely used in electric vehicles, industrial control, automotive electronics, renewable energy (such as photovoltaics), household appliances, consumer electronics, and other fields. In particular, it holds a high market share in the field of international brand electric vehicle controllers.
- RF GaN Packaging
- Power Module
- Intelligent Power Module (IPM)
- Cu Clip
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Gallium-Nitride (GaN) has several advantages over Silicon when it comes to applications in the field of power semiconductor.
GaN- based power devices have an estimated of 10-100 times faster switching characteristic as compared with Silicon-based devices. This makes the GaN assembly as one of the desirable technology that can enable the highest-performance, smallest and most cost effective RF modules.
ATX has engaged into several GaN assemblies, including the use of the highest thermal Silver Sintering epoxy, that can deliver more than 200W/mK of thermal conduction capability.
ATX has developed GaN packaging several solutions to address the fast growing needs of RF infrastructure into QFN and DFN package, including the use of 20mil leadrame thickness.
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ATX portfolio of Power Module has the integration of several inductors, FETs, and other passive components into a single package solution which being driven at 4mm mold body thickness. It covers all aspect of packaging solutions including Laminate (BGA and LGA) and leadframe based packages. For Open Cavity configuration includes the flip chip dice and passive component underneath the huge inductor as well as side by side options.
ATX engineering approach in using Compression molding process instead of the transfer mold has gained several advantages such as elimination of voids due to the mold flow issue. Benefits in increase strip panel utilization enables lower assembly cost as this solution has allowed ATX to use single panel strip configurations.
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Intelligent Power Module or IPM is an integration of power switches and gate drivers to form a high performance module. It also composes of customs ICs with main function of self-protection in terms of short circuits, under voltage supplies, and over temperature.
ATX has initiates to venture to IPM as additional Power Module portfolio, integration of several IGBTs, diodes, PCBs, and other power ICs to complete an Intelligent Power Module for industrial and commercial applications.
IPM encapsulation involves both plastic and ceramic options. Though transfer mold will be the main solution, Gel encapsulation will also be an option as well.
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Cu Clip is the most desirable replacement of wirebond for high performance MOSFETS and other power devices.
Cu clip is highly being implemented in discrete products, as main target application belongs to industrial, telecommunication infrastructure, mobile computers, and automotive.
ATX Weihai, a dedicated facility for Cu Clip has a vast and extensive experience in volume production. Its facility has been constantly expanding its capacity to address growing demands from its customers especially in the field of automotive electrifications.
Application
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Automotive
Semiconductor industry involving automotive application has increased significantly through the advanced automotive intelligence and battery technology. Automotive semiconductors involve variations of packages that have access to engine system, lightning, and infotainment components. ATX has vast amount of packaging portfolio and manufacturing solutions for the development of Automotive ecosystem. Packaging Technology: • QFN with wettable flank features • Flip chip • MEMs and Sensor • Power module • SOIC and TSOP Legacy packages • Power Discretemore -
5G Radio
ATX has a high varieties of assembly toolbox for RF and other 5G radio requirements. This is to make sure that ATX is at the forefront of technological advancement to address the challenges that are associated with 5G. ATX has made a significant investment to establish its own RF Laboratory and to offer the shortest turn-around time in Developing and fine tuning of RF products. With Suzhou Campus as the center of its R&D Department and Engineering Center, ATX ensures that customers can have the benefits of 5G services at its highest excellence, through the advanced RF hardware resources, engineering skills, and development facilities available. Customer can co-work to develop models for electrical, thermal, and mechanical simulations. As an extended service, ATX can offer its customers with its signal integrity simulation, test, and RF characterization capability. 1. Ag sintering with capability up to >200W/mK for enhance thermal conductivity. 2. RF Shielding Capability 3. Double Sided Module (DSM) with Solder Ball and Cu Post Solutions. 4.Study Bonding for SAW/BAW Filters. 5. Wirekgnd tuning capability during development & Mass Production periodic monitor.. 6. RF Lab support during product development.more -
Internet of Things (IOT)
As World-Wide-Web application is becoming the main stream for connecting people, Internet of Things (IOT) is the one responsible for the connectivity of objects. These includes:more -
Wired and Wireless Communications
In current and future complex field of communication, ultra high speed, ultra high-frequency, extreme low-latency and multiple channel characteristics have bought the highest technical challenges to a semiconductor packaging capability. By providing a full range of advanced packaging and testing solutions, development collaboration in design and simulations, and by offering of full automated assembly are the key recipe to address the complexity of the modern communication assembly requirements.more -
Memory/Mixed Signal/Logic
Increasing demand for functionality and capacity for memory, mixed signal and logic ICs, ATX die stacking process expertise offers a consistent product, high level of yield and reliability performance. An established wafer thinning process down to 25um and with the use of thin DAF and advanced material such as Film over Wire (FOW), Die attach with capability to handle thin die pick and place, wirebonding with low loop down to 35um creates a robust process which is a main recipe for volume production. By future roadmap, ATX is highly committed to developing an advanced packaging solution to be a able to address Memory, Mixed signal, and logic ever growing demand for capacity and functionality.more -
True Wireless Stereo (TWS)
With the onset of Bluetooth Audio Technology, wireless earbuds have experienced explosive business growth and currently represents one of the fastest-growing consumer product in audio segments. 建立TWS组件的一个独特之处和困难需要软件编程能力。 这是 音频模块开发中最复杂的部分和 我们的研发部门目前正在全力解决这些主要问题要求。 3D SiP stacking will be the main process tool to maximize benefits for TWS assembly: • Downsizing • High density function integration • Better space utilizationmore -
Wearable products
Wearable products refer to smart devices that can be worn directly on the user's body, utilizing integrated technologies such as sensors, processors, and wireless communications to achieve various functions including health monitoring, information reminders, entertainment interactions, and more. They typically come in the form of watches, bracelets, glasses, clothing, and other forms, providing users with a more convenient and intelligent life experience.more