| Product Overview |
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| The features of small outline package (SOP) are similar to SOJ, except that the leads' end is formed in the shape of a gull-wing. SSOP is the shrunk version of SOP, with lead pitch narrowed from 1.27mm (50mil) to 0.635mm (25mil). The shrunk body means flexible layout within finite PCB area. Another advantage is that shorter leads improve the electrical performance. |
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| Application |
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| ATX’s SOP/SSOP product was designed in compliance with JEDEC standards. Applications includes low pin count packages used in cellular phones, wireless LAN, personal digital assistants, digital cameras, video, and information appliances. |
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| Features |
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| SOP Body sizes 154 up to 450 mils |
| SSOP Body sizes 300 mils |
| SOP lead counts available from 8 to 32 |
| SSOP lead counts available 48 & 56 |
| JEDEC standard outlines |
| Existing BOM and process flow |
| Pb-free process ready and available |
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| Reliability |
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| Package Level |
| Test Item |
Reference Standard |
Condition/Duration |
| MSL |
JEDEC 22-A103 |
Level 3, 30ºC/60% RH, 192 hrs |
| TCT |
JEDEC 22-A104-B |
-65ºC to 150ºC, 100/300/500/1000 cycles |
| HAST |
JEDEC 22-A118 |
130ºC/85% RH, 33.5 PSI 48/96 hrs |
| HTST |
JEDEC 22-A103-B |
150ºC, 500/1000 hrs |
| THT |
JEDEC 22-A101-B |
85’C/85%RH 500/1000 hrs |
| PCT |
JEDEC 22-A102 |
121ºC/100%RH/15 psi ,96/168 hours |
| Thermal shock test |
JEDEC JESD22-A106 |
-65ºC~150ºC, 100 / 300 / 500 cycles |
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| Board Level (Contact ATX for further details.) |
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| Package Offering |
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| Package |
Body Size |
Lead Count |
Pitch |
| SOP |
150mil |
8, 14, 16 |
1.27mm |
| SOP EP |
150mil |
8, 14 |
1.27mm |
| SOP |
300mil |
16, 18, 20, 28 |
1.27mm |
| SOP EP |
300mil |
16 |
1.27mm |
| MFP |
208mil |
8 |
1.27mm |
| SSOP |
209mil |
20 |
0.65mm |
| TSSOP |
118mil |
8, 10 |
0.5mm |
| TSSOP EP |
118mil |
10 |
0.5mm |
| TSSOP |
173mil |
8, 14, 16, 20 |
0.65mm |
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