Design Offers

ATXSZ offers full-service package design service to help customers to optimize package form factor and cost structure.

Proven Experience

Design team is experienced in the following types of package design:
• System-in-Package (SiP)
• Flip Chip
• Stacked Die
• Multi-Chip Modules
• Fine Pitch Packages
• High Pin Count
• Lead Frame
• Land Grid Array
• Ball Grid Array

Design Output Format

a. Bonding Diagram: AutoCAD (*.dwg); Acrobat (*.pdf)
b. Layout Drawing: AutoCAD (*.dwg); Acrobat (*.pdf)
c. Tooling Drawing: AutoCAD (*.dwg); Acrobat (*.pdf)

Design Tools available

• Cadence MCM/SiP/OrCAD Capture CIS
• DownStream CAM350
• Autodesk：AutoCad
• Automation APP: iAutoR, iModify, iTransform AutoCAD

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