Lab Service
Industry-Recognized Excellence
ATXSZ Lab operates a state-of-the-art, engineering driven reliability laboratory for device qualification and reliability evaluation needs. Customers can rely on ATXSZ Labs' expertise in engineering services to characterize, evaluate, compare, and assess foundry sources, and assembly processes. Reliability services include product suitability and reliability analysis on devices designed for use in computers, consumer electronics, automobiles, networking and telecommunications equipment, medical devices, military applications, and many more.
Trusted Services Supported by Experienced Staff
ATXSZ Lab is committed to serving the semiconductor community and help customers get their products to the market quickly. With decades of experience, the engineering experts can work with customers to develop a test plan and get the data needed to ensure quality products. All reliability services tests are performed per JEDEC, MIL STD, IEC, ISO, or other customer-specific standards.
Environmental Testing Services
1. Pre-Conditioning Service
Plastic SMD subject to preconditioning sequence prior to moving into reliability testing
2. Highly-Accelerated Temperature and Humidity Stress Test (HAST)
Determine susceptibility to corrosion
3. Steady-State Temperature Humidity Bias Life (THB)
Define and evaluate the moisture resistance on non- hermetic packages
4. Temperature Cycling Test (TCT)
Determination of device's ability to resist extreme temperature variation Device and board level
testing available
5. Autoclave (Pressure Pot)
Ability of device to withstand severe temperature and humidity conditions under applied pressure
6. Moisture soak Sensitivity Level Analysis (MSLA)
Accelerated test to determine device resistance to corrosion
7. High Temperature Storage (HTS) and Low Temperature Storage (LTS)
Long-term storage at elevated temperatures
Failure Analysis
1. Photography and Optical Microscopy
Non-destructive visual inspection of the sample
2. Radiography Inspection (X-Ray)
Non-destructive analysis to exam the interior of a device, including 3D capability
3. Curve Tracer & Probe test
Non-destructive electrical failure confirm
4. Cross-Section
Destructive internal mechanical exposure of a die or package
5. Parallel Lapping
Destructive delayering of devices: die or package
6. Decapsulation
Destructive process performed to expose internal package for examination, including copper bond wire
7. Scanning Electron Microscopy (SEM)
Surface inspection of specimens at high magnifications (up to 600,000x)
8. Energy Dispersive Spectroscopy (EDS/EDX)
Analysis to determine the elemental composition of an external target area
9. Scanning Acoustic Microscopy
Non-destructive internal package inspection to detect anomalies delamination
10. Dye & Pry
Red dye under pressure penetrates cracks and delaminations in solder balls. Pry to separate device
from PCB and examine optically. Also used for crack/ingress identification in cross sections and
parallel lapping
11. Solderability Test
Determines solderability of device package terminations that are intended for attachments
12. Cratering Test
13. IMC Test & Measurement
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